Chosen from among the multitude of inventions created by Bobst employees that were awarded a patent for the first time in 2023, Lair’s invention excelled in all four criteria: current and future commercial value, technical value for the customer, and product marketability. As such, it represents a breakthrough solution that contributes to elevating productivity, efficiency and quality in packaging production, while minimizing the environmental impact.

“The annual Inventor Award is an incredibly important initiative within the Bobst organization. It recognizes the high skills level, dedication and innovative mindset of our employees across the globe, which is the foundation for the continued success of Bobst and its customers,” said Leonard Badet, Chief Technology Officer at Bobst.

The winning invention, Sealing of Bernoulli module, introduces a basic system that makes it easy to install a simple braking mechanism, called a Bernoulli brake, at the entrance of a platen. It achieves this by using multiple modules that are made using 3D printing technology. With this innovative system, assembling such modules becomes much easier. In addition, it has the potential to reduce the cost of machine manufacturing and the volume of air needed in operation.

Mr Badet commented, “With this invention, Tim is leveraging his expertise in additive manufacturing to drive development in the design of parts and assemblies, keeping Bobst at the bleeding edge of innovation. He also plays an instrumental part in training the next generation by transmitting his specialized knowledge in this field to our apprentices and trainees.”

Developed to increase the awareness of Bobst’s strong intellectual property portfolio, the annual Inventor Award scheme is sponsored by CEO Jean-Pascal Bobst.

Bobst remains committed to fostering innovation that drives progress in the packaging industry, benefiting both our clients and the environment. We look forward to seeing the positive impact of Lair's invention on the industry and continuing to support groundbreaking advancements in packaging technology.